Vacuum Deposition Systems

RF/DC Magnetron Sputtering System

Our RF/DC Magnetron Sputtering Systems are designed for thin film deposition of metals, oxides,and compound materials. These systems offer precise control over film thickness, composition, anduniformity.

Key Features:

  • Single or multi-target configurations
  •  RF, DC, or combined power supply modes
  •  Substrate heating and bias options
  • Automatic pressure control with mass flow controllers
  •  Compact, modular design for research and industrial use

Applications: Thin film coatings, semiconductor devices, optical films, nanostructures.

Thermal Evaporation System

The Thermal Evaporation Unit enables controlled deposition of high-purity films under vacuum using resistive or electron beam heating.

Key Features:

  • High-vacuum compatible chamber

  • Quartz crystal thickness monitor

  • Resistive heating sources (boat, filament, or crucible)

  • Optional substrate rotation and heating

  • Easy-to-maintain modular design

Applications: Metal and oxide film deposition, optical coatings, sensor fabrication.

Chemical Vapor Deposition (CVD) System

Our CVD Systems are engineered for uniform thin film formation through chemical reactions undercontrolled temperature and pressure.

Key Features:

  • Horizontal or vertical quartz tube furnace

  • Precise gas flow control using MFCs

  • Automated temperature and process monitoring

  • Safety interlocks and exhaust system integration

Applications: Synthesis of nanomaterials, 2D materials, and semiconductor coatings.